All production work is carried out at LAB ID premises.

Tag Assembly lines, based on flip chip process, are die - independent.
Therefore LAB ID can successfully use any of the ICs currently available.

Lab Id uses both copper and aluminum antennas on PET substrate.
Currently we have two inlay/inlet assembly lines.

inlay assembly line 01
Single production line for Inlay assembly
Up to 1.800 uph high speed (reel-to -reel)
High accuracy chip placement based on flip chip technology ( +/- 20 um)
In-line inlay test system with bad unit marking
Wafer size 6", 8"
Die size (edge - length ): 500x500um

inlay assembly line 02
Flexible production line for  Inlay assembly
Up to 4.500 uph high speed ( reel - to - reel)
High accuracy chip placement based on flip chip technology ( +/- 20 um)
In-line inlay test system with bad unit marking
Wafer size 6", 8"
Die size (edge- length ): 400x400um

label/paper ticket lamination line
Single production line for Inlay lamination
Up to 10.000 uph high speed
High accuracy lamination
Max Size: 150 mm x 150mm